Double Sided Polyimide Tape 300℃ High Temperature Resistant with Double-sided Uniform Adhesive Coating and 260℃ Long-term Heat Resistance for FPC PCB Electronic Components
Product Details
| Material: | Polyimide Film + Double-sided High Temp Adhesive | Color: | Amber / Golden Transparent |
|---|---|---|---|
| Total Thickness: | 0.05mm / 0.06mm / 0.08mm / 0.10mm / 0.12mm | Temperature Resistance: | -40℃ ~ 260℃ Long-term, 300℃ Instant |
| Adhesive Type: | Silicone Adhesive / Acrylic Adhesive Optional | Dielectric Strength: | ≥150kV/mm |
Product Description
- Double-sided Uniform Adhesive Coating - Both sides evenly coated with high-temperature glue, balanced adhesion, no warping after lamination
- 260℃ Long-term Heat Resistance - Stable bonding performance during SMT reflow and high-temperature aging test, no delamination
- High Bonding Strength & Good Stability - Strong initial adhesion and holding power, fits metal, plastic, FPC and circuit board surfaces tightly
- H-class Insulation & Dimensional Stability - Low CTE, anti-aging, excellent insulation for precision electronic lamination
- Clean & Residue-Free Removal - High-purity adhesive formula, no glue residue after high-temperature peeling
Double-sided Polyimide Tape is a high-performance dual-coating bonding and insulating material. It uses high-strength polyimide film as the base material, with uniform high-temperature resistant adhesive coated on both top and bottom sides.
Different from single-sided PI tape, this double-sided design realizes high-temperature resistant bonding + electrical insulation integration. It maintains stable adhesion and flatness after repeated high and low temperature cycles, avoiding layer separation and edge lifting. It is widely used for FPC fixing, electronic component lamination, heat sink bonding and precision electronic assembly.
| Material | Polyimide Film + Double-sided High Temp Adhesive |
| Color | Amber / Golden Transparent |
| Total Thickness | 0.05mm / 0.06mm / 0.08mm / 0.10mm / 0.12mm |
| Temperature Resistance | -40℃ ~ 260℃ Long-term, 300℃ Instant |
| Adhesive Type | Silicone Adhesive / Acrylic Adhesive Optional |
| Insulation Grade | H Class |
| Flame Retardant Level | UL94 V-0 |
| Dielectric Strength | ≥150kV/mm |
| Feature | Double-sided bonding, high temp resistant, no delamination |
| Custom Service | Custom width, length, precision die-cut shapes |
- Uniform Double-sided Bonding Performance - Dual-side glue coating with balanced tension, no curling or warping after pasting, ensuring flat lamination for precision electronic parts.
- Excellent High Temperature Stability - No foaming, no delamination, no falling off during high-temperature baking and reflow soldering process, suitable for long-term high-temperature working conditions.
- Strong Multi-material Fit - Stable adhesion on FPC, PCB, metal shell, heat sink and plastic surfaces, good holding power for long-term fixing.
- Outstanding Insulation & Anti-aging Ability - Effectively prevent electric leakage and short circuit, resist thermal aging and temperature cycle impact.
- Easy Precision Processing - Smooth film surface, uniform thickness, support slitting, die-cutting and automatic machine pasting.
Packaging: Anti-static protective packaging + standard export carton
MOQ: 1 Roll
Port: Shanghai / Ningbo / Guangzhou
Payment Terms: T/T, L/C, PayPal, Western Union
Product Highlights
Double-sided polyimide tape with uniform adhesive coating for 260℃ long-term heat resistance, strong bonding, H-class insulation, and residue-free removal. Ideal for FPC, PCB, and electronic component lamination.
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Double Sided Polyimide Tape 300℃ High Temperature Resistant with Double-sided Uniform Adhesive Coating and 260℃ Long-term Heat Resistance for FPC PCB Electronic Components
Double-sided polyimide tape with uniform adhesive coating for 260℃ long-term heat resistance, strong bonding, H-class insulation, and residue-free removal. Ideal for FPC, PCB, and electronic component lamination.
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